Chipworks has posted a teardown of the new iPhone SE, revealing the hybrid nature of the device, with many iPhone 6s components mixed in with iPhone 5s and iPhone 6 internals. As expected, the new four-inch iPhone includes the same A9 flagship processor as the one found in the iPhone 6s, bearing a part number and date code indicating that it originated in a TSMC facility only nine weeks ago.
The teardown also reveals the same 2GB LPDDR4 mobile DRAM used in the iPhone 6s, 16GB of Toshiba flash, and a NXP 66V10 NFC and Secure Element chip, again the same one as used in the iPhone 6s. Other components that Chipworks identified in common with the iPhone 6s include the audio chips and the six-axis inertial sensor.
On the other hand, the Qualcomm modem and RF transceiver in the iPhone SE are from the iPhone 6 and iPhone 6 Plus generation, while Broadcom and TI chips are from the iPhone 5s generation. Chipworks noted a new Texas Instruments chip in the iPhone SE as well, bearing a 338S00170 number, which the report describes as likely to be a new Apple/Dialog power management circuit, as well as a Skyworks SKY77611 power amplifier, an EPCOS D5255 antenna switch module, and an AAC Technologies 0DALM1 microphone.
